Outlay

Award

THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ADVANCED TECHNOLOGY MAINTAINABILITY OF THE MICROELECTRONICS-BASED COUNTER UNMANNED AIRCRAFT SYSTEM

Recipient
RAYTHEON COMPANY
Awarding agency
Department of Defense
Sub-agency
Defense Microelectronics Activity
Fiscal year
FY2024
Obligated (promised)
$216,902,654
Total obligation (detail)
$216,902,654
Potential value (ceiling)
$216,902,654
Outlaid (paid out, linked File C)
no linked financial data
Signed
Aug 27, 2024
Period of performance
Aug 27, 2024 – Dec 31, 2026
Competition
FULL AND OPEN COMPETITION
Offers received
1
Solicitation
SUBJECT TO MULTIPLE AWARD FAIR OPPORTUNITY
Pricing
COST PLUS FIXED FEE
NAICS
541330 — ENGINEERING SERVICES
Award type
DELIVERY ORDER

Structural flags (1)

  • Competed award, single offer received

    These contracts were officially open for any company to compete, but only one company showed up. Sometimes only one company really can do the job; sometimes the contest was set up so only one could win.

    extent_competed=A · number_of_offers_received=1

    Rule single_bid_competed, methodology v1.2.0 definition and caveats

Transactions (3)

0Aug 27, 2024$178,140,565THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR ADVANCED TECHNOLOGY MAINTAINABILITY OF THE MICROELECTRONICS-BASED COUNTER UNMANNED AIRCRAFT SYSTEM
P00001Sep 12, 2025SUPPLEMENTAL AGREEMENT FOR WORK WITHIN SCOPE$38,762,089THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO DEPLOY OPERATIONAL ENHANCEMENTS
P00002Jan 26, 2026SUPPLEMENTAL AGREEMENT FOR WORK WITHIN SCOPE$0THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO DEPLOY OPERATIONAL ENHANCEMENTS

Record history in our archive

Outlay keeps a content-hashed copy of this record from every pull. No post-publication revisions observed so far.

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