Outlay

Award

RF MODULE ASSEMBLY

Recipient
FAIRWINDS TECHNOLOGIES LLC
Awarding agency
Department of Defense
Sub-agency
Defense Logistics Agency
Fiscal year
FY2026
Obligated (promised)
$96,753,368
Total obligation (detail)
$96,753,368
Potential value (ceiling)
$96,753,368
Outlaid (paid out, linked File C)
no linked financial data
Signed
Oct 10, 2025
Period of performance
Oct 10, 2025 – Jun 18, 2031
Competition
FULL AND OPEN COMPETITION
Offers received
5
Solicitation
SUBJECT TO MULTIPLE AWARD FAIR OPPORTUNITY
Pricing
FIRM FIXED PRICE
NAICS
334419 — OTHER ELECTRONIC COMPONENT MANUFACTURING
Award type
DELIVERY ORDER

Transactions (7)

0Oct 10, 2025$96,753,368RF MODULE ASSEMBLY
P00001Oct 17, 2025OTHER ADMINISTRATIVE ACTION$0RF MODULE ASSEMBLY
P00002Nov 20, 2025OTHER ADMINISTRATIVE ACTION$0RF MODULE ASSEMBLY
P00003Dec 17, 2025OTHER ADMINISTRATIVE ACTION$0RF MODULE ASSEMBLY
P00004Mar 2, 2026OTHER ADMINISTRATIVE ACTION$0RF MODULE ASSEMBLY
P00005Mar 18, 2026OTHER ADMINISTRATIVE ACTION$0RF MODULE ASSEMBLY
P00006Apr 13, 2026FUNDING ONLY ACTION$0RF MODULE ASSEMBLY

Record history in our archive

Outlay keeps a content-hashed copy of this record from every pull. No post-publication revisions observed so far.

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