Outlay

Award

HQ072726FE016

View source record on USAspending.gov ↗

THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO DEVELOP AND INSTALL AN AIR BASE AIR DEFENSE (ABAD) IN THE AFRICOM THEATER FOR PROTECTION AGAINST AIR, UAS, AND CRUISE MISSILE THREATS

Recipient
RAYTHEON COMPANY
Awarding agency
Department of Defense
Sub-agency
Defense Microelectronics Activity
Fiscal year
FY2026
Obligated (promised)
$103,626,343
Total obligation (detail)
$103,626,343
Potential value (ceiling)
$133,832,704
Outlaid (paid out, linked File C)
no linked financial data
Signed
Apr 7, 2026
Period of performance
Apr 7, 2026 – Apr 30, 2029
Competition
FULL AND OPEN COMPETITION
Offers received
1
Solicitation
SUBJECT TO MULTIPLE AWARD FAIR OPPORTUNITY
Pricing
COST PLUS FIXED FEE
NAICS
541330 — ENGINEERING SERVICES
Award type
DELIVERY ORDER

Structural flags (1)

  • Competed award, single offer received

    These contracts were officially open for any company to compete, but only one company showed up. Sometimes only one company really can do the job; sometimes the contest was set up so only one could win.

    extent_competed=A · number_of_offers_received=1

    Rule single_bid_competed, methodology v1.2.0 — definition and caveats

Transactions (1)

0Apr 7, 2026—$103,626,343THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS TO DEVELOP AND INSTALL AN AIR BASE AIR DEFENSE (ABAD) IN THE AFRICOM THEATER FOR PROTECTION AGAINST AIR, UAS, AND CRUISE MISSILE THREATS

Record history in our archive

Outlay keeps a content-hashed copy of this record from every pull. No post-publication revisions observed so far.

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