Outlay

Award

HQ072725FE061

View source record on USAspending.gov ↗

THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR CONTINUED REFINEMENT, ENHANCEMENT, AND DELIVERY OF SENSE AND INTERCEPT EQUIPMENT

Recipient
RAYTHEON COMPANY
Awarding agency
Department of Defense
Sub-agency
Defense Microelectronics Activity
Fiscal year
FY2025
Obligated (promised)
$262,996,909
Total obligation (detail)
$262,996,909
Potential value (ceiling)
$262,996,909
Outlaid (paid out, linked File C)
no linked financial data
Signed
Sep 25, 2025
Period of performance
Sep 25, 2025 – Mar 31, 2028
Competition
FULL AND OPEN COMPETITION
Offers received
1
Solicitation
SUBJECT TO MULTIPLE AWARD FAIR OPPORTUNITY
Pricing
COST PLUS FIXED FEE
NAICS
541330 — ENGINEERING SERVICES
Award type
DELIVERY ORDER

Structural flags (1)

  • Competed award, single offer received

    These contracts were officially open for any company to compete, but only one company showed up. Sometimes only one company really can do the job; sometimes the contest was set up so only one could win.

    extent_competed=A · number_of_offers_received=1

    Rule single_bid_competed, methodology v1.2.0 — definition and caveats

Transactions (1)

0Sep 25, 2025—$262,996,909THE ADVANCED TECHNOLOGY SUPPORT PROGRAM (ATSP) CONTRACT ACQUIRES PROGRESSIVE MICROELECTRONIC CAPABILITY SOLUTIONS FOR CONTINUED REFINEMENT, ENHANCEMENT, AND DELIVERY OF SENSE AND INTERCEPT EQUIPMENT

Record history in our archive

Outlay keeps a content-hashed copy of this record from every pull. No post-publication revisions observed so far.

  • detailfirst capture